MediaTek has big plans for 2020. Part of the new plans was to re-enter the flagship market, which they did, and to bring 5G to the midrange segment. The company announced its new line of chipset dubbed Dimensity that will help it achieve this goal.
Dimensity 1000 was the first chipset in line with integrated 5G. On top of that, the Taiwanese semiconductor company has recently announced a new chipset in the series to power budget-friendly mid-range phones.
It, therefore, has less computational power than the Dimensity 1000 and 1000L. Targeting the mid-range category, Dimensity 800 SoC is a direct competitor to Qualcomm’s Snapdragon 700 series and Huawei’s Kirin 800 series chipsets.
The Dimensity 800 SoC has a Helio M70 5G modem that brings 5G support onboard. That means we should expect theoretical speeds of up to 4.7Gbps downlink and 2.5Gbps uplink. Plus, support for both SA and NSA standards.
The company did not detail much on the technicals but said we should expect commercial devices powered by this chip available as soon as Q2 2020. Manufacturers expected to utilize this chipset include Samsung, Xiaomi, Realme, Oppo, and Huawei.